1、先外部，后內(nèi)部。不要?jiǎng)硬粍?dòng)就打開機(jī)殼，沒有初步的判斷和排除就喜歡鋪開攤子，指望打開機(jī)殼看哪里有斷線或明顯故障之處,純粹是在碰運(yùn)氣，即使好運(yùn)也不可能每次都這樣。約有50%故障是由外部環(huán)境或操作、清潔等造成的。如是否關(guān)機(jī)時(shí)間長了？晝夜溫差是否很大？儀器放置的位置是否離電梯間很近? 儀器附近還有什么儀器在使用？計(jì)算機(jī)設(shè)置是否正確？等等。

1. First external, then internal. Don't open the casing at any moment. If you don't have a preliminary judgment and troubleshooting, you like to spread out the situation. Relying on opening the casing to see where there are broken wires or obvious faults is purely a stroke of luck. Even good luck cannot always be like this. About 50% of malfunctions are caused by external environments, operations, cleaning, etc. Is the shutdown time too long? Is there a significant temperature difference between day and night? Is the instrument placed close to the elevator? What other instruments are in use near the instruments? Is the computer settings correct? Wait a minute.

2、先電源，后主機(jī)；先附件，后主機(jī)。應(yīng)先檢查電源是否穩(wěn)定、負(fù)載是否過重、地線是否良好、電極等附件是否良好和正常、各接口是否正確等。

2. Power supply first, then host; First the attachment, then the host. It is necessary to first check whether the power supply is stable, whether the load is too heavy, whether the ground wire is in good condition, whether the electrodes and other accessories are in good and normal condition, and whether all interfaces are correct.

3、充分利用儀器面板上各種按鍵、顯示屏幕和操作 或維修程序等。

3. Make full use of various buttons, display screens, and operation or maintenance programs on the instrument panel.

4、了解用戶的操作習(xí)慣、操作人員結(jié)構(gòu)和水平，科室經(jīng)濟(jì)情況等也會(huì)對維修有很大幫助。如可推斷清潔保養(yǎng)的如何，是否有欲更新的想法。

4. Understanding the user's operating habits, the structure and level of operators, and the economic situation of the department can also be of great help in maintenance. If it can be inferred how the cleaning and maintenance are going, do you have any ideas for updates.

5、不輕易更換原來儀器上的元器件和板子、管道等，因?yàn)橛行┰骷c板子、軟件數(shù)據(jù)相關(guān)。更不能靠不停地?fù)Q板子和部件來縮小故障源。

5. It is not easy to replace the original components, boards, pipelines, etc. on the instrument, as some components are related to board and software data. We cannot reduce the source of faults by constantly replacing boards and components.